New

Advanced Packaging Section Manager, Process Development Engineering

SkyWater Technology
life insurance, paid time off, paid holidays, 401(k)
United States, Florida, Kissimmee
200 NeoCity Way (Show on map)
May 06, 2026
Bold Thinking. World Changing. At SkyWater, our ingenuity helps improve lives around the world by manufacturing U.S. made semiconductors that are essential ingredients of modern life. Automotive safety enhancements, life-saving medical devices, consumer electronics and American security require semiconductors. Working in our Minnesota headquarters, Florida, or Texas location - employees join together to improve the world. Explore what's possible. Joining our U.S. - based team means contributing to and learning about the commercialization of some of the most exciting technologies the world has ever seen. We are turning "science fiction" into everyday reality through technologies such as superconducting, 3D integrated circuits or computer chips, carbon nanotubes, photonic logic devices, micro electro-mechanical systems and other emerging device topologies. We manufacture products for aerospace and defense, medical, automotive, consumer and industrial markets, to name a few. Our customers include emerging leaders who rely on our intellectual property security and quality manufacturing services. Step into the future. SkyWater's values of Integrity, Excellence, Collaboration, Empowerment and Growth Mindset guide us to cultivate an empowered, learning environment. We also invest in developing highly skilled, dedicated employees - and employees who are entering the workforce for the first time, from the military, and a variety of educational backgrounds. Are you bold thinking? Find your place on our team and help us change the world! Position Summary: We are seeking a hands-on engineering leader to drive process development and team performance within our Advanced Packaging organization. This role leads a team of Process Development Engineers and is responsible for delivering stable, scalable, and high-performing processes across multiple packaging technologies. You' will operate at the intersection of engineering, manufacturing, and equipment balancing technical depth with leadership to improve yield, throughput, and capability. Major Area of Accountability: Lead and develop a team of Process Development Engineers supporting advanced packaging technologies, including Fan-Out Wafer Level Packaging, Interposers, Hybrid Wafer-to-Wafer Bonding, and Die-to-Wafer Bonding. Preferred experience in one or more of the following areas: Wafer Singulation, Solder Bumping, Die Attach, Compression Molding, Hybrid Bonding, Temporary Bond/Debond, Lamination, Maskless Lithography, Thin Films (PVD/CVD), Dry / Wet Etch, Diffusion, Electroplating (ECD), CMP, Metrology and Probe/Test. Drive process performance through data owned SPC strategy, implementation, and continuous improvement. Responsible for the ongoing Process Development activities of the team in support of all Advanced Packaging Technologies. Lead, develop, and manage a team of Process Development Engineers across multiple Advanced Packaging disciplines. Hands-on engineering leader to drive process development and team performance within our Advanced Packaging organization. This role leads a team of Process Development Engineers and is responsible for delivering stable, scalable, and high-performing processes across multiple packaging technologies. Operate at the intersection of engineering, manufacturing, and equipment balancing technical depth with leadership to improve yield, throughput, and capability. Partner with equipment engineering and maintenance to resolve tool issues, eliminate chronic failures, and improve uptime. Oversee process qualification and ramp of new tools to expand fab capability and capacity. Lead root cause analysis and implement permanent corrective actions for yield and reliability issues. Collaborate cross-functionally with production, integration, procurement, and vendors to meet business objectives. Balance multiple priorities across development, production support, and continuous improvement initiatives. Required Qualifications BS in Engineering (Materials Science, Electrical, Chemical, Physics, or related). 5-7 years of semiconductor manufacturing experience, including advanced packaging. Demonstrated leadership experience (formal or informal). Strong understanding of process integration and upstream/downstream interactions. Proven problem-solving capability using structured methodologies. Experience with SPC, APC, and data-driven process control. Proficiency with data analysis tools such as JMP or MATLAB. Ability to manage multiple priorities and deliver results in a fast-paced environment. US Citizenship Required: This position will require the holding of, or ability to obtain, a US government security clearance. The annual salary range for this role is $114,320 - $171,480. Pay offered is based on many factors including, but not limited to, the job-related experience, skills, education, and credentials of each candidate. SkyWater offers an exciting environment where the brightest semiconductor minds come together to achieve exceptional results. We offer competitive salary and an opportunity to participate in incentive plans as well other employee financial benefits including 401k match, life insurance and opportunities to purchase SkyWater stock at a discounted rate. Additionally, SkyWater offers a comprehensive benefits package which promotes a healthy life. This includes benefit eligibility day one, medical, dental, mental health benefits, vision, legal planning, short- and long-term disability, paid time off, paid holidays, an on-site fitness facility, and an on-site self-serve market. SkyWater complies with federal and state disability laws and makes reasonable accommodations for applicants and employees with disabilities unless doing so would cause an undue hardship. Alternative methods of applying for employment are available to individuals unable to submit an application through this site because of a disability. To request reasonable accommodations, to participate in the job application or interview process, to perform essential job functions, and/or to receive other benefits and privileges of employment, please contact Human Resources at 952-851-5200 or Recruiting@SkyWatertechnology.com. EOE, including disability/vets